Exploring new foundations for cryptographic security—and the physical limits of the systems that power it.
LSCO brings together research in post-quantum cryptographic primitives, information theory, and extreme-density microelectronics. Our work examines both the mathematical foundations of security and the materials, power, and thermal constraints of advanced computing.
Investigating resilient data infrastructure and the engineering needed to support the next generation of compute.
Research into non-lattice cryptographic approaches and dynamical systems. The Event Horizon Protocol explores information-theoretic security foundations and adversarial bounds beyond computational hardness assumptions.
Project GATEWAY examines extreme-density compute architectures and their thermal constraints. Our research spans novel substrates, thermal resistance modeling, and heat extraction pathways for high-density computing environments.
Higher compute density demands a rigorous understanding of how heat moves through the full materials stack. GATEWAY studies three-dimensional conduction, substrate geometry, and junction temperature constraints to develop engineering baselines for advanced architectures.
These are research design parameters under study. They are not claims of achieved commercial performance.
A research path that connects theoretical models, explicit assumptions, and practical integration requirements.
Identify the mathematical and physical constraints. Define threat models, security assumptions, and architecture requirements before making performance claims.
Study cryptographic adversarial bounds and model thermal resistance, conduction pathways, and junction temperature limits against explicit design parameters.
Work with industry and government stakeholders to evaluate operational integration, testing requirements, and pathways into critical systems.
For researchers, industry partners, and government stakeholders working at the intersection of cryptography, advanced microelectronics, and critical infrastructure.